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[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274)

[Available for preview] - Low dielectric resin, high-frequency circuit boards, semiconductor packaging materials, optoelectronic fusion -

★5G/6G and the proliferation of generative AI support high-speed, high-capacity communication devices and materials all in one place! ★Requirements for materials used in 2.xD, 3D implementation, chiplets, and next-generation packaging, along with development examples from various companies. －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 【Low Dielectric Loss Materials】 - Achieving low dielectric constant and adhesion - Design of PPE resin - Solvent-soluble polyimide resin - Fluorine resin with adhesion properties - Film formation of liquid crystal polymers - Olefin-based low dielectric films - Low dielectric halogen-free flame retardants - Development of glass cloth 【Fine Circuit Formation】 - Improving adhesion of difficult-to-bond materials - Copper sulfate plating process - High-adhesion Cu seed layer - Low-resistance, adhesive Cu layer formation technology 【Semiconductor Package Substrate Materials】 - Reducing thermal expansion of organic core materials - Interlayer insulating films - Solder resist - Photosensitive films - For high-end computers - FO-WLP, FO-PLP - For WOW process 【Co-Packaged Optics】 - Co-Packaged Optics - Compact and high-density optical packaging - Silicon photonics - Optical transceivers

• Company：TECHNICAL INFOMATION INSTITUTE CO.,LTD
• Price：10,000 yen-100,000 yen

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